Integrated circuit interconnect structure having discontinuous barrier layer and air gap

ABSTRACT

A method includes providing a substrate, a dielectric layer over the substrate, and metallic features over the dielectric layer; and forming an organic blocking layer (OBL) over the dielectric layer and between lower portions of the metallic features. The OBL covers sidewall surfaces of the lower portions, but not upper portions, of the metallic features. The method further includes depositing a dielectric barrier layer over top surfaces of the metallic features and over the sidewall surfaces of the upper portions of the metallic features, wherein at least a portion of a top surface of the OBL is not covered by the dielectric barrier layer; forming an inter-metal dielectric (IMD) layer between the metallic features and above the OBL; and removing the OBL, leaving an air gap above the dielectric layer, below the dielectric barrier layer and the IMD layer, and laterally between the lower portions of the metallic features.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs and, for these advancements to berealized, similar developments in IC processing and manufacturing areneeded.

For example, the continuing device miniaturization presents challengesto interconnect structures. In some designs, interconnect structures usemetal lines isolated with dielectric layers. As the metal lines getcloser to each other, the stray capacitance become larger and thelikelihood of shorting the metal lines due to metal diffusion andmigration over time also increases. Further, the dielectric layers mayinclude some high-k dielectric materials. These materials also increasethe stray capacitance.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a flowchart of a method of fabricating a semiconductor deviceaccording to aspects of the present disclosure in one or moreembodiments.

FIGS. 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I, and 2J show cross-sectionalschematic views of a semiconductor device manufactured by the method ofFIG. 1 , in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. In addition, the presentdisclosure may repeat reference numerals and/or letters in the variousexamples. This repetition is for the purpose of simplicity and clarityand does not in itself dictate a relationship between the variousembodiments and/or configurations discussed. Moreover, the performanceof a first process before a second process in the description thatfollows may include embodiments in which the second process is performedimmediately after the first process, and may also include embodiments inwhich additional processes may be performed between the first and secondprocesses. Various features may be arbitrarily drawn in different scalesfor the sake of simplicity and clarity. Furthermore, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,elements described as being “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the exemplary term “below” can encompass both an orientation ofabove and below. The apparatus may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein may likewise be interpreted accordingly. Still further, whena number or a range of numbers is described with “about,” “approximate,”and the like, the term encompasses numbers that are within certainvariations (such as +/−10% or other variations) of the number described,in accordance with the knowledge of the skilled in the art in view ofthe specific technology disclosed herein, unless otherwise specified.For example, the term “about 5 nm” may encompass the dimension rangefrom 4.5 nm to 5.5 nm, 4.0 nm to 5.0 nm, etc.

The present disclosure is generally related to semiconductor devices andmanufacturing methods thereof. More particularly, the present disclosureis related to semiconductor back-end-of-line (BEOL) processing andinterconnect structures. Semiconductor BEOL processing is performedafter transistors as well as other active and/or passive devices havebeen processed in or on a semiconductor substrate. It generally involvesforming connectivity network that interconnects the active and/orpassive devices. The connectivity network (or interconnect structures)includes multiple layers of metal lines vertically stacked layer bylayer. The metal lines of one layer are connected to other metal linesin adjacent layers through metal vias. The metal lines and metal viasare embedded in dielectric layers. Stray capacitance (or parasiticcapacitance) unavoidably exists between the metal lines simply becauseof their proximity to each other. Stray capacitance is more pronouncedfor metal lines in the same layer as they usually run parallel for asignificant length. Stray capacitance is unwanted as it slows down thecircuit operation, increases power consumption, and increases couplingnoise. Stray capacitance is generally proportional to the dielectricconstant of the dielectric material present between the metal lines andinversely proportional to the distance between the metal lines. As themetal lines get closer, new ways of isolating the metal lines areneeded, which is an object of the present disclosure.

In some embodiments of the present disclosure, adjacent metal lines inthe same layer are isolated by three materials—a high dielectricconstant (high-k) material, a low dielectric constant (low-k) material,and air in the form of an air gap. Each material serves its uniquepurpose. For example, the low-k material provides certain mechanicalstrength and stability to the metal layer, the high-k material providesa barrier between the metal lines and the low-k material, and the airgap lowers the total effective dielectric constant of the isolation. Theair gap also eliminates or reduces the likelihood of metal diffusion ormigration between the metal lines. Embodiments of the present disclosureprovide improved interconnect structures for highly integrated circuits.

FIG. 1 shows a method 100 of making a semiconductor structure with thenew and improved interconnect structure, according to various aspects ofthe present disclosure. The method 100 is briefly described below. Themethod 100 includes an operation 102 where an initial structure of anintegrated circuit is received or provided. The initial structureincludes a semiconductor substrate with active and/or passive devicesformed therein or thereon. The initial structure further includes adielectric layer over the semiconductor substrate. The dielectric layermay have conductive elements such as metal lines and/or vias embeddedtherein. Over the dielectric layer is a metal layer. The method 100further includes an operation 103 where the metal layer is patternedinto metal lines and trenches are provided between the metal lines andabove the dielectric layer. The method 100 further includes an operation104 where an organic blocking layer (OBL) is deposited to partially fillthe trenches. The OBL is decomposable into small molecules under athermal process or by ultraviolet (UV) irradiation. The method 100further includes an operation 106 where a dielectric barrier layer isdeposited onto the surfaces of the metal lines that are not covered bythe OBL. The dielectric barrier layer includes a high-k material in anembodiment. Due to hydrophobic property of the OBL, the dielectricbarrier layer is not deposited on the OBL (other than possibly the edgearea of the OBL). The method 100 further includes an operation 108 wherean inter-metal dielectric (IMD) layer is deposited to fill the trenches.The IMD layer includes a low-k material in an embodiment. The method 100further includes an operation 110 where the IMD layer is planarizedusing a chemical-mechanical planarization (CMP) process. The method 100further includes an operation 112 where the OBL is removed by a thermalprocess or by UV irradiation. The thermal process or UV irradiationdecomposes the OBL into small molecules which subsequently escapethrough the IMD layer. The space formerly occupied by the OBL becomes anair gap. Thus, an isolation structure is formed between the metal lines.The isolation structure includes the dielectric barrier layer, the IMDlayer, and the air gap. The method 100 performs further steps inoperation 114 to complete the fabrication of the integrated circuit. Themethod 100 is merely an example, and is not intended to limit thepresent disclosure beyond what is explicitly recited in the claims.Additional operations can be provided before, during, and after themethod 100, and some operations described can be replaced, eliminated,or moved around for additional embodiments of the method. The method 100will be further described below in conjunction with FIGS. 2A-2J whichillustrate schematic cross-sectional views of a semiconductor device 200in various fabrication stages according to the method 100, in accordancewith some embodiments.

In some embodiments, the device 200 is a portion of an IC chip, a systemon chip (SoC), or portion thereof, that includes various passive andactive microelectronic devices such as resistors, capacitors, inductors,diodes, p-type field effect transistors (PFETs), n-type field effecttransistors (NFETs), FinFET, nanosheet FETs, nanowire FETs, other typesof multi-gate FETs, metal-oxide semiconductor field effect transistors(MOSFETs), complementary metal-oxide semiconductor (CMOS) transistors,bipolar junction transistors (BJTs), laterally diffused MOS (LDMOS)transistors, high voltage transistors, high frequency transistors, othersuitable components, or combinations thereof. In some embodiments, thedevice 200 includes a non-volatile memory, such as a non-volatile randomaccess memory (NVRAM), a flash memory, an electrically erasableprogrammable read only memory (EEPROM), an electrically programmableread-only memory (EPROM), other suitable memory type, or combinationsthereof. FIGS. 2A-2H have been simplified for the sake of clarity tobetter understand the inventive concepts of the present disclosure.Additional features can be added in the device 200, and some of thefeatures described below can be replaced, modified, or eliminated inother embodiments of the device 200.

Referring to FIG. 1 , at operation 102, the method 100 receives orprovides an initial structure of the device 200, an example of which isshown in FIG. 2A. As shown in FIG. 2A, the device 200 includes asubstrate 202 and a dielectric layer 204 over the substrate 202. Thedielectric layer 204 may include metallic features 206. The device 200further includes a metal layer 208 over the dielectric layer 204. Themetal layer 208 is electrically connected to the metallic features 206.Components of the device 200 are further described below.

In embodiments, the substrate 202 includes a silicon (Si) substrate,such as a silicon wafer. Alternatively, the substrate 202 may compriseanother semiconductor, such as germanium (Ge); a compound semiconductorsuch as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide(InAs), and indium phosphide (InP); or an alloy semiconductor, such assilicon germanium (SiGe), silicon germanium carbide (SiGeC), galliumarsenic phosphide (GaAsP), and gallium indium phosphide (GaInP); orcombinations thereof. In yet another alternative, the substrate 202includes a semiconductor on insulator (SOI) substrate.

The substrate 202 includes active devices such as p-type field effecttransistors (PFET), n-type FET (NFET), metal-oxide semiconductor fieldeffect transistors (MOSFET), complementary metal-oxide semiconductor(CMOS) transistors, bipolar transistors, high voltage transistors, andhigh frequency transistors. The transistors may be planar transistors ormulti-gate transistors such as FinFETs, nanowire FETs, and nanosheetFETs. The transistors generally include source/drain terminals and gateterminals. The substrate 202 may further include passive devices such asresistors, capacitors, and inductors.

The substrate 202 also includes one or more isolation structures forisolating the various transistors, resistors, capacitors, and inductors.The isolation structures may include shallow trench isolation, deeptrench isolation, field oxide, LOCal Oxidation of Silicon (LOCOS), orother suitable structure; and may include silicon oxide (SiO₂), siliconnitride (Si₃N₄), silicon oxynitride (SiON), fluoride-doped silicateglass (FSG), a low-k dielectric material, and/or other suitableinsulating material. The substrate 202 may also include one or moredielectric layers over the various transistors, resistors, capacitors,and inductors. For example, the one or more dielectric layers mayinclude silicon nitride (Si₃N₄), silicon oxynitride (SiON), siliconnitride with oxygen (O) or carbon (C) elements, doped or undopedsilicate glass, silicon oxide, and/or other materials. Further, thesubstrate 202 may include conductors embedded in the one or moredielectric layers, such as source/drain contacts, gate contacts,source/drain contact vias, gate contact vias, metal lines, metal vias,and so on. The conductors provide electrical connectivity to the varioustransistors, resistors, capacitors, and inductors.

In embodiments, the surface of the dielectric layer 204 includes one ormore functional groups that are bondable to silane. For example, thedielectric layer 204 includes silanol (Si—O—H) in an embodiment. In someembodiments, the dielectric layer 204 includes an oxide (i.e., siliconoxide), in which case the dielectric layer 204 may also be referred toas oxide layer 204. For example, the dielectric layer 204 may includematerials such as tetraethylorthosilicate (TEOS) formed oxide, un-dopedsilicate glass, or doped silicon oxide such as borophosphosilicate glass(BPSG), fluoride doped silica glass (FSG), phosphosilicate glass (PSG),boron doped silica glass (BSG), and/or other suitable dielectricmaterials. The dielectric layer 204 may be deposited by a plasmaenhanced chemical vapor deposition (PECVD) process, a flowable chemicalvapor deposition (FCVD) process, or other suitable deposition technique.

The metallic features 206 may include metal lines and/or metal vias. Themetallic features 206 are embedded in the dielectric layer 204 andelectrically connected to various conductive features in the substrate202. The metallic features 206 may include tungsten (W), cobalt (Co),copper (Cu), other metals, metal nitrides such as titanium nitride(TiN), titanium aluminum nitride (TiAlN), tungsten nitride (WN),tantalum nitride (TaN), or combinations thereof, and may be formed bychemical vapor deposition (CVD), physical vapor deposition (PVD),electro-chemical plating (ECP), electroless plating, and/or othersuitable processes. In some embodiments, the metallic features 206include a layer of metal nitride (e.g., TiN, TiAlN, WN, or TaN)surrounding a layer of metal (e.g., W, Co, or Cu).

The metal layer 208 includes a metal that has low resistance and yetamenable to an etching process, such as reactive ion etching or otheretching methods including dry etching and wet etching. For example, themetal layer 208 may include ruthenium (Ru), tungsten (W), molybdenum(Mo), titanium (Ti), cobalt (Co), aluminum (Al), or other metal(s). Insome embodiment, the metal layer 208 may include copper (Cu) although Cumay be more difficult to etch than some other metals. In an embodiment,the metal layer 208 is deposited using PVD, CVD, sputtering, ECP,electroless plating, or other suitable processes.

At operation 103, the method 100 (FIG. 1 ) patterns the metal layer 208into metallic features, referred to as metallic features 208, such asshown in FIG. 2B. Trenches 210 are provided between adjacent metallicfeatures 208 and above the dielectric layer 204. Some sidewall surfaces208 a and 208 b of the metallic features 208 face each other across thetrench 210. The metallic features 208 may include metal lines and/ormetal vias. In an embodiment, the metallic features 208 are metal linesthat are oriented lengthwise into and out of the page of FIG. 2B. Themetallic features 208 are provided on the dielectric layer 204. Some ofthe metallic features 208 are electrically connected to the metallicfeatures 206 in the dielectric layer 204. In an embodiment, theoperation 103 includes photolithography and etching processes. Forexample, a photolithography process may be performed to form an etchmask over the metal layer 208 of FIG. 2A, and the etch mask providesopenings corresponding to the trenches 210. An example photolithographyprocess includes coating a photoresist (or resist) layer, soft baking ofthe resist layer, mask aligning, exposure, post-exposure baking,developing the resist layer to form a resist pattern, rinsing, anddrying (e.g., hard baking) the resist pattern. The resist pattern can beused as an etch mask for etching the metal layer 208. Alternatively, theresist pattern can be transferred to another layer (such as ananti-reflective coating layer) underneath, which is used as the etchmask for etching the metal layer 208. Subsequently, the metal layer 208is etched through the openings of the etch mask to remove portions ofthe metal layer, forming the trench 210. The remaining portions of themetal layer 208 become the metallic features 208. Each of the metallicfeatures 208 has a top surface and two sidewall surfaces. FIG. 2Billustrates a sidewall surface 208 a of a metallic feature 208 faces asidewall surface 208 b of another metallic feature 208. The surfaces 208a and 208 b as well as portions of the top surface of the dielectriclayer 204 are exposed in the trenches 210. In some embodiments, some ofthe trenches 210 have a wider opening at its top portion than at itsbottom portion.

At operation 104, the method 100 (FIG. 1 ) forms an organic blockinglayer (OBL) 212 that partially fills the trenches 210, such as shown inFIG. 2C. In the present embodiment, the OBL 212 includes a materialhaving small molecules, a polymer, or organometallic compounds that canbe decomposed into vapor, for example, by heating it up or irradiatingit with UV lights. Further, the OBL 212 includes one or more functionalgroups that are linkable to the surface of the dielectric layer 204, forexample, by forming chemical bonds with the dielectric layer 204. Insome embodiments, the OBL 212 may include a silane complex composed ofreactive silyl ligand for nucleophilic reaction with an oxide layer(which is an example of the dielectric layer 204). Examples of suchsilane complex (which are organometallic compounds) includeCr(CO)₅(η²-HSiEt₃), Mo(CO)₅(η²-HSiEt₃), and W(CO)₅(η²-HSiEt₃). In anembodiment, the OBL 212 includes silanol functional groups R—Si(OH)x, Ris alkyl or aryl group, such as trimethylsilanol, dimethylphenylsilanol,triphenylsilanol and dimethylsilanediol) that are linkable to oxidelayer by dehydration. In some embodiments, the OBL 212 includes Si(OR)₃where R is an alkyl group such as methyl, ethyl, propyl, or butyl group.In some embodiments, the OBL layer 212 may include a polymer such aspoly(neopentul methacrylate-co-ethylene glycol dimethacrylate)copolymer, polycarbonate, polyester or other suitable material can reactwith the hydroxyl groups on oxide layer. Still further, the OBL 212 isgenerally hydrophobic in the present embodiment.

In the present embodiment, the OBL 212 is deposited to only partiallyfill the trenches 210, while some sidewall surfaces (such as thesurfaces 208 a and 208 b) of the metallic features 208 are still exposedin the trenches 210. The OBL 212 may be deposited using CVD, molecularlayer deposition (MLD), or a wet coating method such as spin coating,dipping, blade-coating, and immersion coating. For example, the OBL 212may be deposited using CVD where small molecules and/or precursors ofthe OBL 212 react with the dielectric layer 204 (for example, thesurface of the dielectric layer 204 includes silanol) to form a thinfilm of a deposit until a desired thickness of the OBL 212 is reached.Extra molecules and/or precursors are purged by a carrier gas such asargon. For another example, the OBL 212 may be deposited using MLD wherea first layer of small molecules or organometallic compounds aredeposited to form chemical bonds with the dielectric layer 204, and asecond layer of molecules are deposited by linking to the first layer.This may repeat layer-by-layer until a desired thickness of the OBL 212is reached. In embodiments where the OBL 212 is deposited using a wetcoating method, a solution may be prepared by dissolving a material forthe OBL 212 in a solvent. The solvent can be protic in an embodiment oraprotic in an alternative embodiment. A protic solvent refers to asolvent having a labile H⁺, such as a hydrogen atom bound to an oxygen(as in a hydroxyl group), a nitrogen (as in an amine group), or fluoride(as in hydrogen fluoride). An aprotic solvent refers to a solvent thathas no labile H. Further, an aprotic solvent can be either polar aproticor non-polar aprotic. The solution is applied to the device 200 by a wetcoating method such as spin coating, dipping, blade-coating, orimmersion coating. The material reacts with the dielectric layer 204 todeposit a thin film in the trench 210. Extra solution is washed off fromthe trench 210. In various embodiments, the OBL 212 is deposited under atemperature below 400° C. because most of the materials suitable for theOBL 212 vaporize or decompose at a temperature higher than 400° C.

In various embodiments, the OBL 212 is deposited to a thickness d1 thatis about 2 Å to about 100 Å depending on the materials selected and thedepth of the trench 210. As will be discussed, the OBL 212 will bedecomposed and removed, thereby forming an air gap in its place. If theOBL 212 is too thin (for example, d1<2 Å), then the air gap might be toosmall and its effect on capacitance reduction would be greatlydiminished. If the OBL 212 is too thick (for example, d1>100 Å), then itmight be difficult to decompose and to remove the OBL 212. Thus, thethickness d1 of the OBL 212 is generally designed to be in a range ofabout 2 Å to about 100 Å. In some embodiments, the thickness d1 may bedesigned to be a fraction of the depth d2 of the trenches 210 (i.e., thethickness of the metallic features 208). For example, a ratio of d1 tod2 (d1:d2) may be in a range of about 0.25 to about 0.5. If the ratio istoo small (such as less than 0.25), then the air gap might be relativelytoo small and its effect on capacitance reduction would be diminished.If the ratio is too big (such as greater than 0.5), then it might bedifficult to decompose and to remove the OBL 212. In some embodiments,the depth d2 is about 20 nm to about 200 nm depending on the level ofthe metal layer 208 in the device 200. For example, a low metal layer(such as M0 layer) may have metal features as thick as 20 nm, while ahigh metal layer (such as a top metal layer) may have metal features asthick as 200 nm. To further such embodiments, the thickness d1 may bedesigned according to the ratio discussed above. In some embodiments,the method 100 includes an etching back process after the OBL 212 isdeposited. The etching back process recesses the OBL 212 to a desiredthickness. In these embodiments, the OBL 212 may be initially depositedto fill the trenches 210.

At operation 106, the method 100 (FIG. 1 ) forms a dielectric barrierlayer 214 covering the surfaces of the metallic features 208 that arestill exposed after the operation 104, such as shown in FIG. 2D.Referring to FIG. 2D, in the present embodiment, the dielectric barrierlayer 214 is deposited to have a substantially uniform thickness alongthe top and sidewall surfaces of the metallic features 208. Thedielectric barrier layer 214 functions to isolate the adjacent metallicfeatures 208. Without the dielectric barrier layer 214, metal elementsfrom the metallic features 208 may diffuse into a low-k dielectric layerthat is subsequently formed adjacent the metallic features 208, such asthe layer 216 in FIG. 2G. Over time, the diffused metal elements maycause short circuit defects. In an embodiment, the dielectric barrierlayer 214 includes a high-k dielectric material. High-k dielectricmaterial generally refers to dielectric materials having a highdielectric constant, for example, greater than that of silicon oxide(k≈3.9). In various embodiments, the dielectric barrier layer 214 mayinclude one or more metal nitrides, metal oxides, and/or metal silicide.For example, the dielectric barrier layer 214 may include La₂O₃, Al₂O₃,ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Y₂O₃, AlON, TaCN, ZrSi, TaN,TiN or other suitable material(s). The dielectric barrier layer 214 maybe deposited using ALD, CVD, PVD, ECP, ELD (electroless deposition), orother suitable methods, and may have a thickness of about 5 Å to about50 Å in various embodiments, as measured on the sidewalls of themetallic features 208 along the “x” direction. If the dielectric barrierlayer 214 is too thin (for example, less than 5 Å), it may not providesufficient barrier function as discussed above. If the dielectricbarrier layer 214 is too thick (for example, greater than 50 Å), itwould unnecessarily increase the stray capacitance between the metallicfeatures 208. In an embodiment, due to the hydrophobic property of theOBL 212, the dielectric barrier layer 214 is not deposited on the OBL212 other than some edge areas of the OBL 212. The dielectric barrierlayer 214 may or may not touch the edge areas of the OBL 212. As shownin FIG. 2D, the sidewall surfaces of the metallic features 208 (such asthe surfaces 208 a and 208 b) are covered by the dielectric barrierlayer 214 and the OBL 212. The dielectric barrier layer 214 isnon-continuous from one metallic feature 208 to another. Each of thetrenches 210 is partially filled by the OBL 212 and the dielectricbarrier layer 214.

At operation 108, the method 100 (FIG. 1 ) deposits an inter-metaldielectric (IMD) layer 216 over the OBL 212 and the dielectric barrierlayer 214, such as shown in FIG. 2E. Referring to FIG. 2E, the IMD layer216 fills the remaining portions of the trenches 210 that are notoccupied by the OBL 212 and the dielectric barrier layer 214. Further,the IMD layer 216 is deposited to overflow above the metallic features208. In various embodiments, the IMD layer 216 includes a dielectricmaterial including, for example, silicon oxide, silicon nitride, siliconoxynitride, tetraethylorthosilicate (TEOS) formed oxide, phosphosilicateglass (PSG), borophosphosilicate glass (BPSG), low-k dielectricmaterial, other suitable dielectric material, or combinations thereof.Example low-k dielectric materials include fluoride doped silica glass(FSG), boron doped silica glass (BSG), carbon doped silicon oxide,xerogel, aerogel, amorphous fluorinated carbon, parylene,benzocyclobutene (BCB), polyimide, other low-k dielectric material, orcombinations thereof. In the depicted embodiment, the IMD layer 216 is adielectric layer that includes a low-k dielectric material (generallyreferred to as a low-k dielectric layer). For example, the IMD layer 216includes a material having a dielectric constant (k value) lower than orequal to 3. In some embodiments, the IMD layer 216 includes an extremelow-k dielectric material, for example, with k lower than 2.3. Having alow dielectric constant in the IMD layer 216 advantageously reduces thestray capacitance between the metallic features 208. Further, the IMDlayer 216 may include a porous material where the pores in the IMD layer216 help the small molecules of the OBL to scape there through. The IMDlayer 216 may be deposited using CVD, PECVD, FCVD, or other suitablemethods. In some embodiments, the IMD layer 216 is formed by an FCVDprocess that includes, for example, depositing a flowable material (suchas a liquid compound) over the device 200 and converting the flowablematerial to a solid material by a suitable technique, such as thermalannealing and/or UV irradiation treating.

At operation 110, the method 100 (FIG. 1 ) performs a CMP process to theIMD layer 216. Referring to FIG. 2F, the operation 110 planarizes theIMD layer 216 and partially removes it until the top surface of thedielectric barrier layer 214 is exposed. In an embodiment, thedielectric barrier layer 214 may be used as an etch stop for CMP endpoint detection. As a result of the operation 110, the top surface ofthe dielectric barrier layer 214 and the top surface of the IMD layer216 become substantially co-planar.

At operation 112, the method 100 (FIG. 1 ) removes the OBL 212 from thedevice 200, thereby forming an interconnect layer 219 as illustrated inFIG. 2G. In an embodiment, the operation 112 includes exposing thedevice 200 to UV lights such that the OBL 212 decomposes and turns intovapor molecules. To further such embodiment, the OBL 212 includesphotolabile protecting groups such as carbamates,N-nitrosodimethylamine, or other suitable functional groups that areamenable to photodissociation, photolysis, or photodecomposition. Inanother embodiment, the operation 112 includes heating the device 200 toan elevated temperature such that the OBL 212 decomposes and turns intovapor. The vapor molecules are small enough to diffuse through the IMDlayer 216, particularly when the IMD layer 216 is of a porous material.In an embodiment, the operation 112 heats the device 200 to atemperature below 400° C. such as in a range from 300° C. to 400° C., ina range from 200° C. to 300° C., or in a range below 200° C. Theselected temperature depends on the material of the OBL 212. Generally,if the molecules in the OBL 212 are larger, then a higher temperature isselected; and if the molecules in the OBL 212 are smaller, then a lowertemperature is selected. Generally, a low temperature is more desiredthan a high temperature in order to preserve the integrity of themetallic features 208 and 206 as well as various conductors in thesubstrate 202. Referring to FIG. 2G, after the OBL 212 is removed, thespace formerly occupied by the OBL 212 becomes an air gap 218. The airgap 218 is surrounded by the dielectric layer 204 at its base, by themetallic features 208 at its sidewalls, and by the dielectric barrierlayer 214 and the IMD layer 216 at its ceiling. The air gap 218advantageously reduces the stray capacitance associated with themetallic features 208. Particularly, the lower portion of the surfaces208 a and 208 b are not covered by any of the dielectric layers 214 and216. This eliminates the concerns of metal diffusion and metal leakagethrough those parts of the metal surfaces. The upper portion of thesurfaces 208 a and 208 b are covered by the dielectric barrier layer216. The space between the upper portion of the metallic features 208are fully filled by the dielectric barrier layer 216 and the IMD 216.The layers 214 and 216 collectively provide mechanical support to themetallic features 208. The interconnect layer 219 includes thediscontinuous dielectric barrier layer 214, the IMD layer 216, themetallic features 208, and the air gaps 218. In embodiments, the air gap218 may have a height d1 (along the “z” direction) in a range from about2 Å to about 100 Å. The importance of d1 being in this range has beendiscussed above. In some embodiments, the OBL 212 is not completelyremoved and some residues of the OBL 212 remain in the air gap 218, anexample of which is illustrate in FIG. 2H.

At operation 114, the method 100 (FIG. 1 ) performs further fabricationsteps to the device 200. For example, it may form one or more dielectriclayers 220 over the interconnect layer 219 and form one or more metallicfeatures 222 over the metallic features 208 and electrically connectingto the metallic features 208, such as shown in FIG. 2I. The method 100may form the dielectric layers 220 and the metallic features 222 using adamascene process or a reverse patterning process. In an embodimentwhere the operation 114 uses a damascene process, the dielectric layers220 are deposited first. Then, trenches (or holes) are etched into thedielectric layer(s) 220 and through the dielectric barrier layer 214 toexpose the metallic features 208. Subsequently, one or more metallicmaterials are deposited into the trenches to form the metallic features222. In an embodiment where the operation 114 uses a reverse patterningprocess, the dielectric barrier layer 214 is patterned (throughphotolithography and etching processes) to form holes that expose themetallic features 222. Then, a metal layer is deposited over theinterconnect layer 219 and filling the holes in the dielectric barrierlayer 214. Subsequently, the metal layer is patterned to form themetallic features 222. Finally, the dielectric layer 220 is deposited tosurround the metallic features 222. In an embodiment, the dielectriclayer 220 and the metallic features 222 are configured with materialsthat are similar to those in the dielectric layer 204 and the metallicfeatures 206, respectively. The method 100 may proceed to forminganother interconnect layer 219′ over the dielectric layer 220, such asillustrated in FIG. 2J. For example, the method 100 may form metal lines(like the metallic features 208) over the dielectric layer 220 andrepeat the operations 104 through 112 to form the interconnect layer219′ with metallic features 208′ isolated by dielectric barrier layer214′, IMD layer 216′, and air gaps 218′. The metallic features 208′, thedielectric barrier layer 214′, the IMD layer 216′, and the air gaps 218′can be formed in the same way as the metallic features 208, thedielectric barrier layer 214, the IMD layer 216, and the air gaps 218,respectively. The method 100 may repeat the above operations until amulti-layer interconnect structure is formed for the device 200.

Although not intended to be limiting, one or more embodiments of thepresent disclosure provide many benefits to an integrated circuit andthe formation thereof. For example, two adjacent metal features (e.g.,metal lines) in an interconnect layer of an IC can be provided with anair gap and without a dielectric barrier layer at the lower portions ofthe metal features while the upper portions of the metal features areisolated by a dielectric barrier layer and an inter-metal dielectriclayer. The air gap reduces the stray capacitance as well as theelectrical leakage between the metal features. This provides a newapproach to forming interconnect layers with improved performance fornew generations of ICs. Embodiments of the present disclosure can bereadily integrated into existing manufacturing flow.

In one example aspect, the present disclosure is directed to a methodfor semiconductor manufacturing. The method includes providing astructure having a substrate, a dielectric layer over the substrate, andtwo metallic features over the dielectric layer. The method furtherincludes forming an organic blocking layer (OBL) over the dielectriclayer and between lower portions of the two metallic features, whereinsidewall surfaces of the lower portions of the two metallic features arecovered by the OBL and sidewall surfaces of upper portions of the twometallic features are not covered by the OBL. The method furtherincludes depositing a dielectric barrier layer over top surfaces of themetallic features and over the sidewall surfaces of the upper portionsof the metallic features, wherein at least a portion of a top surface ofthe OBL is not covered by the dielectric barrier layer. The methodfurther includes forming an inter-metal dielectric (IMD) layer laterallybetween the two metallic features and above the OBL and removing theOBL, leaving an air gap above the dielectric layer, below the dielectricbarrier layer and the IMD layer, and laterally between the lowerportions of the two metallic features.

In an embodiment of the method, the forming of the IMD layer includesdepositing an IMD material over the dielectric barrier layer and the OBLand performing a chemical-mechanical planarization (CMP) process to theIMD material until a top surface of the dielectric barrier layer isexposed. In some embodiment of the method, the OBL includes one of:small molecules with a silanol functional group, a polymer, or anorganometallic compound.

In some embodiment of the method, the forming of the OBL includes achemical vapor deposition (CVD) process, a molecular layer deposition(MLD) process, a spin coating process, a dipping process, ablade-coating process, or an immersion process. In some embodiment, thedielectric barrier layer includes a metal nitride, a metal oxide, or ametal silicide. In some embodiment, the removing of the OBL applies athermal process or a UV irradiation process. In some embodiment, themetallic features include ruthenium, tungsten, molybdenum, titanium,cobalt, or aluminum. In some embodiment, the method further includesforming a metal layer above the dielectric barrier layer and the IMDlayer, wherein the metal layer electrically connects to at least one ofthe two metallic features.

In another example aspect, the present disclosure is directed to amethod for semiconductor manufacturing. The method includes providing astructure having a substrate, a dielectric layer over the substrate, andtwo metallic features over the dielectric layer, wherein a trench isprovided above the dielectric layer and between the two metallicfeatures. The method further includes forming an organic blocking layer(OBL) that fills a lower portion of the trench, wherein the OBL isbonded to the dielectric layer through chemical bonds. The methodfurther includes depositing a dielectric barrier layer over top surfacesof the metallic features and over sidewall surfaces of the metallicfeatures exposed in an upper portion of the trench, wherein at least aportion of a top surface of the OBL is not covered by the dielectricbarrier layer. The method further includes depositing an inter-metaldielectric (IMD) layer over the dielectric barrier layer and the OBL;performing a chemical-mechanical planarization (CMP) process to the IMDlayer until a top surface of the dielectric barrier layer is exposed;and removing the OBL, leaving an air gap in the lower portion of thetrench and below the dielectric barrier layer and the IMD layer.

In some embodiment of the method, the OBL includes one of: smallmolecules with a silanol functional group, a polymer, or anorganometallic compound. In some embodiment, the forming of the OBLincludes a chemical vapor deposition (CVD) process, a molecular layerdeposition (MLD) process, or a wet coating process. In a furtherembodiment, the wet coating process includes applying a solution to thetrench wherein the solution includes the OBL and a solvent. In a furtherembodiment, the solvent includes a protic, a polar aprotic, or anon-polar aprotic solvent.

In some embodiment of the method, the dielectric layer includes siliconoxide. In some embodiment, the dielectric barrier layer includes La₂O₃,Al₂O₃, ZnO, ZrN, Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Y₂O₃, AlON, TaCN,ZrSi, TaN, or TiN.

In yet another example aspect, the present disclosure is directed to asemiconductor structure that includes a substrate; a dielectric layerover the substrate; and two metallic features over the dielectric layer,wherein a first surface of one of the metallic features faces a secondsurface of the other one of the metallic features. The semiconductorstructure further includes an air gap above the dielectric layer andbetween the two metallic features, wherein a lower portion of the firstsurface and a lower portion of the second surface are exposed in the airgap. The semiconductor structure further includes a dielectric barrierlayer above the air gap, wherein a first portion of the dielectricbarrier layer is disposed on an upper portion of the first surface and asecond portion of the dielectric barrier layer is disposed on an upperportion of the second surface. The semiconductor structure furtherincludes a dielectric feature above the air gap and laterally betweenthe first and the second portions of the dielectric barrier layer,wherein the dielectric barrier layer and the dielectric feature includedifferent materials.

In an embodiment, the semiconductor structure further includes aconductive via in the dielectric layer and electrically connecting toone of the metallic features. In some embodiment of the semiconductorstructure, the metallic features include ruthenium, tungsten,molybdenum, titanium, cobalt, or aluminum. In some embodiment, thedielectric barrier layer includes a high-k dielectric material and thedielectric feature includes a low-k dielectric material. In someembodiment, the dielectric barrier layer includes a metal nitride, ametal oxide, or a metal silicide, and the dielectric feature includes aporous material having silicon oxide.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand the aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of theembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A method for semiconductor manufacturing,comprising: providing a structure having a substrate, a dielectric layerover the substrate, and two metallic features over the dielectric layer;forming an organic blocking layer (OBL) over the dielectric layer andbetween lower portions of the two metallic features, wherein sidewallsurfaces of the lower portions of the two metallic features are coveredby the OBL and sidewall surfaces of upper portions of the two metallicfeatures are not covered by the OBL; depositing a dielectric barrierlayer over top surfaces of the metallic features and over the sidewallsurfaces of the upper portions of the metallic features, wherein atleast a portion of a top surface of the OBL is not covered by thedielectric barrier layer; forming an inter-metal dielectric (IMD) layerlaterally between the two metallic features and above the OBL; andremoving the OBL, leaving an air gap above the dielectric layer, belowthe dielectric barrier layer and the IMD layer, and laterally betweenthe lower portions of the two metallic features.
 2. The method of claim1, wherein the forming of the IMD layer includes: depositing an IMDmaterial over the dielectric barrier layer and the OBL; and performing achemical-mechanical planarization (CMP) process to the IMD materialuntil a top surface of the dielectric barrier layer is exposed.
 3. Themethod of claim 1, wherein the OBL includes one of: small molecules witha silanol functional group, a polymer, or an organometallic compound. 4.The method of claim 1, wherein the forming of the OBL includes achemical vapor deposition (CVD) process, a molecular layer deposition(MLD) process, a spin coating process, a dipping process, ablade-coating process, or an immersion process.
 5. The method of claim1, wherein the dielectric barrier layer includes a metal nitride, ametal oxide, or a metal silicide.
 6. The method of claim 1, wherein theremoving of the OBL applies a thermal process or a UV irradiationprocess.
 7. The method of claim 1, wherein the metallic features includeruthenium, tungsten, molybdenum, titanium, cobalt, or aluminum.
 8. Themethod of claim 1, further comprising: forming a metal layer above thedielectric barrier layer and the IMD layer, wherein the metal layerelectrically connects to at least one of the two metallic features.
 9. Amethod for semiconductor manufacturing, comprising: providing astructure having a substrate, a dielectric layer over the substrate, andtwo metallic features over the dielectric layer, wherein a trench isprovided above the dielectric layer and between the two metallicfeatures; forming an organic blocking layer (OBL) that fills a lowerportion of the trench, wherein the OBL is bonded to the dielectric layerthrough chemical bonds; depositing a dielectric barrier layer over topsurfaces of the metallic features and over sidewall surfaces of themetallic features exposed in an upper portion of the trench, wherein atleast a portion of a top surface of the OBL is not covered by thedielectric barrier layer; depositing an inter-metal dielectric (IMD)layer over the dielectric barrier layer and the OBL; performing achemical-mechanical planarization (CMP) process to the IMD layer until atop surface of the dielectric barrier layer is exposed; and removing theOBL, leaving an air gap in the lower portion of the trench and below thedielectric barrier layer and the IMD layer.
 10. The method of claim 9,wherein the OBL includes one of: small molecules with a silanolfunctional group, a polymer, or an organometallic compound.
 11. Themethod of claim 9, wherein the forming of the OBL includes a chemicalvapor deposition (CVD) process, a molecular layer deposition (MLD)process, or a wet coating process.
 12. The method of claim 11, whereinthe wet coating process includes applying a solution to the trenchwherein the solution includes the OBL and a solvent.
 13. The method ofclaim 12, wherein the solvent includes a protic, a polar aprotic, or anon-polar aprotic solvent.
 14. The method of claim 9, wherein thedielectric layer includes silicon oxide.
 15. The method of claim 9,wherein the dielectric barrier layer includes La₂O₃, Al₂O₃, ZnO, ZrN,Zr₂Al₃O₉, TiO₂, TaO₂, ZrO₂, HfO₂, Y₂O₃, AlON, TaCN, ZrSi, TaN, or TiN.16. A semiconductor structure, comprising: a substrate; a dielectriclayer over the substrate; two metallic features over the dielectriclayer, wherein a first surface of one of the metallic features faces asecond surface of the other one of the metallic features; an air gapabove the dielectric layer and between the two metallic features,wherein a lower portion of the first surface and a lower portion of thesecond surface are exposed in the air gap; a dielectric barrier layerabove the air gap, wherein a first portion of the dielectric barrierlayer is disposed on an upper portion of the first surface and a secondportion of the dielectric barrier layer is disposed on an upper portionof the second surface; and a dielectric feature above the air gap andlaterally between the first and the second portions of the dielectricbarrier layer, wherein the dielectric barrier layer and the dielectricfeature include different materials.
 17. The semiconductor structure ofclaim 16, further comprising a conductive via in the dielectric layerand electrically connecting to one of the metallic features.
 18. Thesemiconductor structure of claim 16, wherein the metallic featuresinclude ruthenium, tungsten, molybdenum, titanium, cobalt, or aluminum.19. The semiconductor structure of claim 16, wherein the dielectricbarrier layer includes a high-k dielectric material and the dielectricfeature includes a low-k dielectric material.
 20. The semiconductorstructure of claim 16, wherein the dielectric barrier layer includes ametal nitride, a metal oxide, or a metal silicide, and the dielectricfeature includes a porous material having silicon oxide.